UCIe & Chiplet Interconnect Solutions
WIOWIZ designs and verifies chiplet interconnects based on the UCIe standard and custom D2D protocols. We help teams decompose monolithic SoCs into modular chiplet architectures with verified die-to-die links.
UCIe PHY & Controller Design
UCIe-compliant physical layer and link controller implementation for standard and advanced packaging.
Die-to-Die Protocol Design
Custom D2D protocols for latency-sensitive or bandwidth-critical chiplet communication.
Chiplet Architecture Exploration
Partitioning analysis, bandwidth modeling, and thermal/power co-optimization for multi-die systems.
Interoperability Verification
Protocol compliance testing, link training verification, and multi-vendor chiplet integration validation.
Advanced Packaging Integration
Design-for-packaging constraints, bump planning, and RDL-aware physical implementation.
Reference Implementations
Open-source UCIe D2D reference designs for academic and startup adoption.